MIT

MVL Seminar: Brad Holschuh (1p, 5/14, 33-218)

Development of next-generation compression technologies for the BioSuit using shape memory alloys

Brad Holschuh, Ph.D., MVL

Abstract: We will present an update on research related to active materials development for the BioSuit system. A brief review of first- and second-generation compression technologies using shape memory alloy (SMA) coil actuators will first be presented, followed by a summary of next-generation prototyping efforts conducted during the spring semester (including advancements in modeling, cartridge design, wearable circuitry, and systems integration). We will also discuss ongoing work related to hybrid silicone/SMA textile development with broad wearable technology potential.